- PCB P/N:104_DCP_R2
- Layer Count:4L
- Material:FR-4 TG130
- Board thk:1.6mm
- copper thk:1/1/1/1oz
- Smallest hole size:0.3MM
- No. of holes (pcs):295
- line w/s:12/8mil
- Impedance control. Y / N (Tol %):N
- Su-ce Finishing:ENIG Au:0.05-0.10UM
- Solder Mask Silkscreen:Green
- Single board size:Dim X (mm):80;Dim Y (mm):116
- Panelisation:Dim X (mm):80;Dim Y (mm):116;No Of UPS:1
- Special:peelable mask:N
- Routing/Punching:CNC
